OPTOELECTRONIC AND SEMICONDUCTOR

AUTO MOLDING / TRIM AND FORM / PLATING / DICING SAW

NTAMS180 AUTO MOLDING SYSTEM

⭐ High Precision Grinding & Polishing Performance
Delivers accurate material removal and stable surface finishing quality, improving semiconductor package reliability and consistency.

⚡ Automated Operation for Higher Productivity
Fully automatic processing system reduces manual handling, increases production efficiency, and supports continuous operation.

🎯 Stable Processing with Easy Maintenance
Robust machine structure and user-friendly interface help ensure stable operation, minimize downtime, and simplify maintenance procedures.

NT-TF600 AUTO TRIM AND FORM SYSTEM

⭐ High Speed & Precision Trim/Form Processing
Provides accurate lead trimming and forming performance with stable high-speed operation, improving product quality and manufacturing efficiency.

⚡ Flexible Handling for Multiple Package Types
Supports various semiconductor package sizes and lead frame designs, enabling versatile production capability for different applications.

🎯 Reliable Automation & Reduced Maintenance
Equipped with automatic feeding and user-friendly control system to reduce operator workload, minimize downtime, and enhance production stability.

NT-MGP450 AUTO MGP SYSTEM

⭐ High Speed & Precision Trim/Form Processing
Provides accurate lead trimming and forming performance with stable high-speed operation, improving product quality and manufacturing efficiency.

⚡ Flexible Handling for Multiple Package Types
Supports various semiconductor package sizes and lead frame designs, enabling versatile production capability for different applications.

🎯 Reliable Automation & Reduced Maintenance
Equipped with automatic feeding and user-friendly control system to reduce operator workload, minimize downtime, and enhance production stability.