HELLER 1993 MK7 REFLOW OVEN

⭐ 1. High Productivity for Mass Production
Supports high-volume manufacturing with continuous conveyor system and stable line speed, improving throughput and reducing cycle time.

⚡ 2. Excellent Temperature Uniformity (Low Delta T)
Precise temperature control across the entire PCB ensures consistent solder quality and reduces defects.

🔧 3. Energy Efficient & Low Operating Cost
Designed for lower energy consumption and optimized nitrogen usage, with easy maintenance to reduce long-term operating costs.

HELLER 1936 MK5-F FORMIC REFLOW OVEN

⭐ 1. Reduces Voids and Improves Assembly Strength
The combination of pressure and heat effectively eliminates voids in bonding and underfill processes, resulting in stronger adhesion and higher mechanical stability of the final product.

⚡ 2. Precise and Consistent Temperature and Pressure Control
The advanced pressure chamber with forced convection ensures uniform heat and pressure distribution, delivering stable and repeatable curing quality.

🔧 3. High-Volume Production Capability with Improved Line Efficiency
Designed for SMT and semiconductor manufacturing, the system supports continuous operation, reduces cycle time, and increases overall production throughput.

Heller 1936 MK5-F FORMIC REFLOW OVEN

⭐ 1. Low Delta T & High Reflow Quality Stability
Advanced convection heating system delivers very low Delta T across the PCB, ensuring uniform temperature distribution and highly consistent soldering quality.

⚡ 2. High Efficiency with Low Energy and Nitrogen Consumption
Optimized airflow and intelligent gas management reduce nitrogen usage and power consumption while maintaining high production yield.

🔧 3. Smart Industry 4.0 Integration & Easy Process Control
Built-in process monitoring, CPK software, and data tracking support real-time control, traceability, and stable high-volume SMT production.

Heller 1936 MK5-V VACUUM REFLOW OVEN

⭐ 1. Vacuum Technology for Void-Free Soldering
Advanced vacuum reflow capability significantly reduces voids in solder joints, improving reliability and performance—especially for high-power and automotive applications.

⚡ 2. Excellent Thermal Uniformity with Low Delta T
High-performance convection heating system ensures minimal temperature variation across the PCB, delivering consistent and stable reflow results.

🔧 3. Energy Efficient & Intelligent Process Control
Designed to reduce energy and nitrogen consumption with smart control systems, supporting stable, cost-effective, and high-volume SMT production.