OPTOELECTRONIC AND SEMICONDUCTOR

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Advanced wafer inspection systems delivering high-speed defect detection, precision analysis, and reliable semiconductor quality control.

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A high-precision machine designed to accurately place and bond semiconductor dies onto substrates, lead frames, or packages.
It enhances production efficiency, bonding quality, and reliability for advanced semiconductor and optoelectronic manufacturing.

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Delivering precise and reliable wire bonding for advanced semiconductor packaging.
Enhancing productivity with consistent bond quality and high-accuracy performance.

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Enhancing surface cleanliness and activation for superior bonding performance.
Improving product reliability, yield, and process consistency in semiconductor manufacturing.

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Delivering high-speed, non-contact solder ball placement with exceptional accuracy.
Enhancing process flexibility, reliability, and productivity for advanced packaging applications.

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Enabling ultra-precise bonding for advanced semiconductor and heterogeneous integration.
Delivering superior alignment accuracy, reliability, and high-yield production.

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Delivering precise encapsulation to protect semiconductor devices and enhance reliability.
Ensuring consistent quality and high-throughput production performance.

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Ensuring accurate electrical testing and quality verification for semiconductor devices.
Improving product reliability, yield, and manufacturing efficiency.

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Automating device handling with high speed and precision for seamless testing operations.
Enhancing throughput, accuracy, and production efficiency.