OPTOELECTRONIC AND SEMICONDUCTOR

LZ-2000 LASER SOLDER BALL JETTING

⭐ High Precision Non-Contact Soldering
Uses laser and nitrogen gas to precisely jet molten solder balls onto target pads, enabling accurate micro-scale bonding without mechanical contact.

⚡ Flux-Free & Low Thermal Stress Process
Localized laser heating minimizes thermal impact on surrounding components while supporting clean flux-free soldering for sensitive devices and advanced packaging applications.

🎯 Ideal for Fine Pitch & Advanced Semiconductor Applications
Supports ultra-small solder ball sizes with high repeatability (±5 μm), making it suitable for Camera Modules, 3D Sensors, USB Type-C, MEMS, and advanced semiconductor packaging.