

⭐ Excellent Plasma Cleaning & Surface Activation
Provides highly uniform plasma treatment for cleaning, surface activation, and adhesion improvement in semiconductor, microelectronics, and medical device applications.
⚡ Flexible Batch Processing Design
Supports various part carriers with adjustable shelves and multiple plasma modes (direct/downstream), making it suitable for both R&D and mass production.
🎯 High Process Stability & Easy Operation
Equipped with a 13.56 MHz RF generator with automatic impedance matching and a touchscreen PLC control system for stable, repeatable, and user-friendly operation.
⭐ High-Throughput Plasma Processing
Designed for advanced semiconductor packaging with high-speed inline processing, increasing productivity and reducing cycle time.
⚡ Flexible & Advanced Plasma Treatment
Supports plasma cleaning, surface activation, contamination removal, and adhesion improvement for various applications such as die attach, wire bonding, molding, and underfill processes.
🎯 Excellent Process Uniformity & Automation
Equipped with advanced F3 plasma chamber technology, automated handling systems, and precise process control for stable, repeatable, and highly uniform treatment quality.
