OPTOELECTRONIC AND SEMICONDUCTOR

M17D ULTRASONIC THIN WIRE BONDER

⭐ High Flexibility
Supports multiple bonding processes such as Ball Bonding, Wedge Bonding, Thin/Heavy Wire, and Deep Access Bonding in a single machine.

⚡ Quick Changeover
Bonding systems and tools can be changed within a short time, reducing downtime and improving production efficiency.

🎯 High Bonding Accuracy & Stability
Equipped with advanced Bond Process Control (BPC) for real-time monitoring and automatic parameter adjustment, ensuring stable quality and low defect rates.

M17L ULTRASONIC THIN WIRE BONDER

⭐ Largest Working Area
Offers one of the world’s largest working ranges for thin wire bonders, making it ideal for large components and complex applications.

⚡ High Flexibility & Fast Changeover
Supports multiple bonding processes such as thin wire, thick wire, ribbon, and deep access bonding with quick changeover in less than 15 minutes.

🎯 Advanced Bond Process Control (BPC)
Provides real-time monitoring and automatic adjustment of bonding parameters to ensure stable quality, high precision, and low defect rates.

M17XL ULTRASONIC THIN WIRE BONDER

⭐ Largest Working Area in the Market
Features an ultra-large working range up to 1,130 mm × 700 mm, ideal for large applications such as EV battery modules, power systems, and solar cells.

⚡ Vibration-Free High Precision Bonding
The robotic arm provides extremely stable and vibration-free movement, ensuring micrometer-level positioning accuracy and consistent zero-defect production quality.

🎯 Flexible Automation & Fast Changeover
Supports multiple bonding processes and automation options from manual to inline production, with bond head changeover in less than 15 minutes.

M17LSB ULTRASONIC LASERBONDER

⭐ Hybrid Laser & Ultrasonic Bonding Technology
Combines laser welding and ultrasonic wire bonding in one machine, providing higher flexibility and supporting a wider range of materials such as aluminum, copper, and nickel.

⚡ Higher Current Capacity & Lower Mechanical Stress
Supports larger conductor cross-sections with low bonding force, improving current-carrying capability while reducing damage to sensitive components.

🎯 High Precision & Easy Automation
Equipped with touch down sensors, image recognition, and advanced calibration systems for accurate positioning, stable quality, and easy integration into automated production lines.